Introduces integration technology, V-Link, expanding the possibilities for customersNXP Semiconductors today introduced an innovative new vertical integration technology called V-Link and will be demonstrating at the NXP Technology Forum the first product in the line-up which is based on the i.MX 6SoloX single chip module (SCM). The V-Link bus allows customers to customize their own system adding connectivity, sensing, and other innovative off-the-shelf solutions on top of the base SCM device through package-on-package assembly technology. This addresses applications where customers need to rapidly prototype and create their own unique product offerings in a very limited space.
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