New plug-and-play, solid-state RF cooking module helps reduce time-to-market for appliance OEMs with easy-to-use design for intelligent cooking NXP Semiconductors today announced new solid state RF cooking modules to accompany its popular RF cooking components portfolio. The new module is designed to help engineers rapidly build innovative RF cooking appliances that can achieve a better way of highly efficient, uniform heating, adaptability and consistency of the cooking process than conventional radiant or convection methods. This new RF cooking module offering includes NXP's MKW40Z Kinetis microcontroller (MCU) with a 2.4 GHz RF signal generator, MMG3014 InGap HBT pre-driver, LDMOS MHT1008...
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