Sets benchmark in package size with LFPAK33 MOSFET to power secure connections for automotive OEMs
Eindhoven, Netherlands – May 23, 2016 – NXP Semiconductors (NASDAQ: NXPI) today announced the availability of its new line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK). The LFPAK33 is optimized for high-density automotive applications with a footprint more than 80 percent smaller than the most popular solution in use today. The significantly smaller low-resistance package was created in response to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.
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